Text written in Basque and translated automatically by Elia without any subsequent editing. SEE ORIGINAL
Work for CEIT and TECNUN Intels
2003/07/01 Elhuyar Zientzia Iturria: Elhuyar aldizkaria
The CEIT technology center and the TECNUN university school have signed an agreement with Intel to conduct joint research. The project aims to improve structures much lower than a micron, especially in their capacity for adhesion.
In fact, the microprocessors of computers are built with a superimposed structure or layer, so it is important to improve the adhesion of these structures. This will improve the functionality of microprocessors, resulting in more information and faster transport.
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Gai honi buruzko eduki gehiago
Elhuyarrek garatutako teknologia
